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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
14 years 4 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
FSTTCS
2009
Springer
14 years 2 months ago
Covering of ordinals
The paper focuses on the structure of fundamental sequences of ordinals smaller than ε0. A first result is the construction of a monadic second-order formula identifying a given ...
Laurent Braud
AC
2000
Springer
13 years 7 months ago
State of the art in electronic payment systems
nvented abstract representations of value. As time passed, representations of value became more abstract, progressing from barter through bank notes, payment orders, checks, credit...
N. Asokan, Philippe A. Janson, Michael Steiner, Mi...