In contrast to the common belief that OpenMP requires data-parallel extensions to scale well on architectures with non-uniform memory access latency, recent work has shown that it ...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
We present a novel parallel algorithm for fast continuous collision detection (CCD) between deformable models using multi-core processors. We use a hierarchical representation to ...
This paper presents a distributed multi-robot system designed to solve a team-based search and destroy task. The project was divided into two phases. The initial phase was used to...
J. T. McClain, Bradley J. Wimpey, D. H. Barnhard, ...
This paper addresses the need for formal specification and runtime verification of system-level requirements of distributed reactive systems. It describes a formalism for specifyi...