In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
We present a new approach for the computation of the deformation field between three dimensional (3D) images. The deformation field minimizes the sum of the squared differences b...
Matthieu Ferrant, Simon K. Warfield, Charles R. G....
In recent years, the software engineering community has begun to study program navigation and tools to support it. Some of these navigation tools are very useful, but they lack a ...
Joseph Lawrance, Rachel K. E. Bellamy, Margaret M....
PC grids represent massive computation capacity at a low cost, but are challenging to employ for parallel computing because of variable and unpredictable performance and availabili...
Nagarajan Kanna, Jaspal Subhlok, Edgar Gabriel, Es...
Sensor networks are becoming an important part of the IT landscape. Existing systems, however, are limited in two fundamental ways: lack of data independence, and poor integration...