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MR
2002
100views Robotics» more  MR 2002»
15 years 3 months ago
No-flow underfill flip chip assembly--an experimental and modeling analysis
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
MICCAI
1999
Springer
15 years 8 months ago
3D Image Matching Using a Finite Element Based Elastic Deformation Model
We present a new approach for the computation of the deformation field between three dimensional (3D) images. The deformation field minimizes the sum of the squared differences b...
Matthieu Ferrant, Simon K. Warfield, Charles R. G....
140
Voted
CHI
2008
ACM
15 years 6 months ago
Using information scent to model the dynamic foraging behavior of programmers in maintenance tasks
In recent years, the software engineering community has begun to study program navigation and tools to support it. Some of these navigation tools are very useful, but they lack a ...
Joseph Lawrance, Rachel K. E. Bellamy, Margaret M....
LCPC
2009
Springer
15 years 8 months ago
A Communication Framework for Fault-Tolerant Parallel Execution
PC grids represent massive computation capacity at a low cost, but are challenging to employ for parallel computing because of variable and unpredictable performance and availabili...
Nagarajan Kanna, Jaspal Subhlok, Edgar Gabriel, Es...
CIDR
2007
156views Algorithms» more  CIDR 2007»
15 years 5 months ago
SwissQM: Next Generation Data Processing in Sensor Networks
Sensor networks are becoming an important part of the IT landscape. Existing systems, however, are limited in two fundamental ways: lack of data independence, and poor integration...
René Müller, Gustavo Alonso, Donald Ko...