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VTS
1999
IEEE
66views Hardware» more  VTS 1999»
15 years 6 months ago
A New Bare Die Test Methodology
1 While multichip module technology has been developed for high performance IC applications, the technology is not widely adopted due to economical reasons. One of the reasons that...
Zao Yang, K.-T. Cheng, K. L. Tai
ICSM
1998
IEEE
15 years 6 months ago
Detection of Logical Coupling Based on Product Release History
Code-based metrics such as coupling and cohesion are used to measure a system's structural complexity. But dealing with large systems--those consisting of several millions of...
Harald Gall, Karin Hajek, Mehdi Jazayeri
ICCD
1996
IEEE
134views Hardware» more  ICCD 1996»
15 years 6 months ago
Pausible Clocking: A First Step Toward Heterogeneous Systems
This paper describes a novel communication scheme, which is guaranteed to be free of synchronization failures, amongst multiple synchronous modules operating independently. In thi...
Kenneth Y. Yun, Ryan P. Donohue
POPL
1996
ACM
15 years 6 months ago
Using Parameterized Signatures to Express Modular Structure
Module systems are a powerful, practical tool for managing the complexity of large software systems. Previous attempts to formulate a type-theoretic foundation for modular program...
Mark P. Jones
ACSD
2004
IEEE
118views Hardware» more  ACSD 2004»
15 years 6 months ago
Verification and Implementation of Delay-Insensitive Processes in Restrictive Environments
Abstract. A delay-insensitive module communicates with its environment through wires of unbounded delay. To avoid transmission interference, the absorption of a signal transition m...
Hemangee K. Kapoor, Mark B. Josephs, Dennis P. Fur...