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» NetRaker suite: a demonstration
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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
14 years 5 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
ICCAD
2004
IEEE
100views Hardware» more  ICCAD 2004»
14 years 5 months ago
DynamoSim: a trace-based dynamically compiled instruction set simulator
Instruction set simulators are indispensable tools for the architectural exploration and verification of embedded systems. Different techniques have recently been proposed to spe...
Massimo Poncino, Jianwen Zhu
SOSP
2009
ACM
14 years 5 months ago
RouteBricks: exploiting parallelism to scale software routers
We revisit the problem of scaling software routers, motivated by recent advances in server technology that enable highspeed parallel processing—a feature router workloads appear...
Mihai Dobrescu, Norbert Egi, Katerina J. Argyraki,...
CVPR
2010
IEEE
14 years 4 months ago
Probabilistic 3D Occupancy Flow with Latent Silhouette Cues
In this paper we investigate shape and motion retrieval in the context of multi-camera systems. We propose a new lowlevel analysis based on latent silhouette cues, particularly su...
Li Guan, Jean-Sebastien Franco, Edmond Boyer, Marc...
TEI
2010
ACM
158views Hardware» more  TEI 2010»
14 years 3 months ago
ChainMail: a configurable multimodal lining to enable sensate surfaces and interactive objects
The ChainMail system is a scalable electronic sensate skin that is designed as a dense sensor network. ChainMail is built from small (1”x1”) rigid circuit boards attached to t...
Behram F. T. Mistree, Joseph A. Paradiso