— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
Instruction set simulators are indispensable tools for the architectural exploration and verification of embedded systems. Different techniques have recently been proposed to spe...
We revisit the problem of scaling software routers, motivated by recent advances in server technology that enable highspeed parallel processing—a feature router workloads appear...
Mihai Dobrescu, Norbert Egi, Katerina J. Argyraki,...
In this paper we investigate shape and motion retrieval in the context of multi-camera systems. We propose a new lowlevel analysis based on latent silhouette cues, particularly su...
Li Guan, Jean-Sebastien Franco, Edmond Boyer, Marc...
The ChainMail system is a scalable electronic sensate skin that is designed as a dense sensor network. ChainMail is built from small (1”x1”) rigid circuit boards attached to t...