Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
The trend of increasing speed and complexity in the single-core processor as stated in the Moore’s law is facing practical challenges. As a result, the multi-core processor arch...
Abdullah Kayi, Yiyi Yao, Tarek A. El-Ghazawi, Greg...
This paper deals with one of the fundamental properties of grid computing – transferring code between grid nodes and executing it remotely on heterogeneous hosts. Contemporary mi...
Skeletal parallel programming enables us to develop parallel programs easily by composing ready-made components called skeletons. However, a simplycomposed skeleton program often l...
This paper proposes a cache hierarchy that enables Web search engines to efficiently process user queries. The different caches in the hierarchy are used to store pieces of data w...