To save layout area for electrostatic discharge (ESD) protection design in the SOC era, test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35-Â...
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang