— As nanometer technology advances, the post-CMP dielectric thickness variation control becomes crucial for manufacturing closure. To improve CMP quality, dummy feature filling ...
In this paper, we propose the first wire density driven global routing that considers CMP variation and timing. To enable CMP awareness during global routing, we propose a compac...
In this paper, we propose the first metal-density driven placement algorithm to reduce CMP variation and achieve higher routability. Based on an analytical placement framework, we...
Tung-Chieh Chen, Minsik Cho, David Z. Pan, Yao-Wen...
— Chemical-Mechanical Polishing (CMP) is one of the key steps during nanometer VLSI manufacturing process where minimum variation of layout pattern densities is desired. This pap...