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TCAD
2008
114views more  TCAD 2008»
13 years 10 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
VLSISP
2008
173views more  VLSISP 2008»
13 years 10 months ago
Fast Bit Gather, Bit Scatter and Bit Permutation Instructions for Commodity Microprocessors
Advanced bit manipulation operations are not efficiently supported by commodity word-oriented microprocessors. Programming tricks are typically devised to shorten the long sequence...
Yedidya Hilewitz, Ruby B. Lee
CLUSTER
1999
IEEE
13 years 10 months ago
The Network RamDisk: Using remote memory on heterogeneous NOWs
Efficient data storage, a major concern in the modern computer industry, is mostly provided today by the the traditional magnetic disk. Unfortunately the cost of a disk transfer m...
Michail Flouris, Evangelos P. Markatos
IEPOL
2010
102views more  IEPOL 2010»
13 years 8 months ago
An antitrust analysis of the case for wireless network neutrality
The ongoing debate about possible implementation of regulatory rules requiring “network neutrality” for wireless telecommunications services is inherently about whether to imp...
Gregory L. Rosston, Michael D. Topper
VLSISP
2010
140views more  VLSISP 2010»
13 years 8 months ago
A Split-Decoding Message Passing Algorithm for Low Density Parity Check Decoders
A Split decoding algorithm is proposed which divides each row of the parity check matrix into two or multiple nearly-independent simplified partitions. The proposed method signific...
Tinoosh Mohsenin, Bevan M. Baas