In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
Advances in IC processing allow for more microprocessor design options. The increasing gate density and cost of wires in advanced integrated circuit technologies require that we l...
Kunle Olukotun, Basem A. Nayfeh, Lance Hammond, Ke...
Within the parallel computing domain, field programmable gate arrays (FPGA) are no longer restricted to their traditional role as substitutes for application-specific integrated...
With the expiration of the Data Encryption Standard (DES) in 1998, the Advanced Encryption Standard (AES) development process is well underway. It is hoped that the result of the ...
As high-end computing systems continue to grow in scale, the performance that applications can achieve on such large scale systems depends heavily on their ability to avoid explic...
Gopalakrishnan Santhanaraman, Pavan Balaji, K. Gop...