: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
In this paper we address the problem of designing energy minimizing collision-free maneuvers for multiple agents moving on a plane. We show that the problem is equivalent to that o...
Jianghai Hu, Maria Prandini, Karl Henrik Johansson...
Abstract. In this paper, we give an overview of the Locomotive Simulater/Optimizer (LSO) decision support system developed by us for railroads. This software is designed to imitate...
Artyom G. Nahapetyan, Ravindra K. Ahuja, F. Zeynep...
: ExtraPlanT system is a multi-agent production planning system designed for small factories, which needs to react quickly on market changes. To deal with this requirement, ExtraPl...
In a variety of applications, ranging from data integration to distributed query evaluation, there is a need to obtain sets of data items from several sources (peers) and compute ...