—Intelligent mobile terminals (or users) of next generation wireless networks are expected to initiate voice over IP (VoIP) calls using session set-up protocols like H.323 or SIP...
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Abstract—In packet communication systems, a header is attached to the transmitted packet at each layer. The overhead due to the transmission of the individual header can have a s...
Recent techniques for multicast or broadcast delivery of streaming media can provide immediate service to each client request yet achieve considerable client stream sharing (i.e.,...
Two classic categories of models exist for computer networks: network information flow and network of queues. The network information flow model appropriately captures the multi-ho...