2749 search results - page 118 / 550 » Physical Design of the |
162
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NOCS
2007
IEEE
16 years 8 days ago
2007
IEEE
As embedded computing evolves towards ever more powerful architectures, the challenge of properly interconnecting large numbers of on-chip computation blocks is becoming prominent...
139
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ASPDAC
2006
ACM
15 years 12 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
137
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ASPDAC
2012
ACM
14 years 1 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
196
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SIGCOMM
2004
ACM
15 years 11 months ago
2004
ACM
Name services are critical for mapping logical resource names to physical resources in large-scale distributed systems. The Domain Name System (DNS) used on the Internet, however,...
147
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TVCG
2010
15 years 4 months ago
2010
—We present TanGeoMS, a tangible geospatial modeling visualization system that couples a laser scanner, projector, and a flexible physical three-dimensional model with a standar...