Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
The dependence of the propagation delay of the interlayer 3-D interconnects on the vertical through via location and length is investigated. For a variable vertical through via lo...
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...