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» Power optimal MTCMOS repeater insertion for global buses
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HPCA
2005
IEEE
14 years 3 months ago
Accurate Energy Dissipation and Thermal Modeling for Nanometer-Scale Buses
With technology scaling, power dissipation and localized heating in global and semi-global bus wires are becoming increasingly important, and this necessitates the development of ...
Krishnan Sundaresan, Nihar R. Mahapatra
ASPDAC
2009
ACM
145views Hardware» more  ASPDAC 2009»
14 years 4 months ago
High performance on-chip differential signaling using passive compensation for global communication
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines is pr...
Ling Zhang, Yulei Zhang, Akira Tsuchiya, Masanori ...
ICCD
2008
IEEE
175views Hardware» more  ICCD 2008»
14 years 6 months ago
On-chip high performance signaling using passive compensation
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines(T-lin...
Yulei Zhang, Ling Zhang, Akira Tsuchiya, Masanori ...