101 search results - page 15 / 21 » Publisher Placement Algorithms in Content-Based Publish Subs... |
ISPD
2012
ACM
12 years 3 months ago
2012
ACM
We propose a new multilevel framework for large-scale placement called MAPLE that respects utilization constraints, handles movable macros and guides the transition between global...
CEC
2007
IEEE
14 years 1 months ago
2007
IEEE
— In this paper we present a new algorithm for the Layout Optimization Problem: this concerns the placement of circular, weighted objects inside a circular container, the two obj...
DAC
2012
ACM
11 years 10 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
DAC
2000
ACM
13 years 12 months ago
2000
ACM
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
SIGMOD
2007
ACM
14 years 7 months ago
2007
ACM
We consider in this paper a class of Publish-Subscribe (pub-sub) systems called topic-based systems, where users subscribe to topics and are notified on events that belong to thos...