3 search results - page 1 / 1 » Reusable tool for 300mm intrabay AMHS modeling and simulatio... |
WSC
2007
13 years 9 months ago
2007
The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
WSC
2004
13 years 8 months ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
WSC
1998
13 years 8 months ago
1998
The application of simulation as a performance estimation tool in automated material handling system design is well documented, as is the amount of time required to build, debug, ...