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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
PERCOM
2007
ACM
14 years 7 months ago
BlueTorrent: Cooperative content sharing for Bluetooth users
People wish to enjoy their everyday lives in various ways, among which entertainment plays a major role. In order to improve lifestyle with more ready access to entertainment cont...
Sewook Jung, Uichin Lee, Alexander Chang, Dae-Ki C...
IPPS
2009
IEEE
14 years 2 months ago
High-order stencil computations on multicore clusters
Stencil computation (SC) is of critical importance for broad scientific and engineering applications. However, it is a challenge to optimize complex, highorder SC on emerging clus...
Liu Peng, Richard Seymour, Ken-ichi Nomura, Rajiv ...
ICCBR
2003
Springer
14 years 21 days ago
Case Mining from Large Databases
Abstract. This paper presents an approach of case mining to automatically discover case bases from large datasets in order to improve both the speed and the quality of case based r...
Qiang Yang, Hong Cheng
ASPLOS
2008
ACM
13 years 9 months ago
No "power" struggles: coordinated multi-level power management for the data center
Power delivery, electricity consumption, and heat management are becoming key challenges in data center environments. Several past solutions have individually evaluated different ...
Ramya Raghavendra, Parthasarathy Ranganathan, Vani...