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TCAD
2008
114views more  TCAD 2008»
13 years 9 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
BC
2005
127views more  BC 2005»
13 years 9 months ago
Computational modeling and exploration of contour integration for visual saliency
Abstract Weproposeacomputationalmodelofcontourintegration for visual saliency. The model uses biologically plausible devices to simulate how the representations of elements aligned...
T. Nathan Mundhenk, Laurent Itti
TISSEC
2008
235views more  TISSEC 2008»
13 years 8 months ago
SDAP: A Secure Hop-by-Hop Data Aggregation Protocol for Sensor Networks
Hop-by-hop data aggregation is a very important technique for reducing the communication overhead and energy expenditure of sensor nodes during the process of data collection in a...
Yi Yang, Xinran Wang, Sencun Zhu, Guohong Cao
TON
2008
103views more  TON 2008»
13 years 8 months ago
On the race of worms, alerts, and patches
We study the effectiveness of automatic patching and quantify the speed of patch or alert dissemination required for worm containment. We focus on random scanning as this is repres...
Milan Vojnovic, Ayalvadi J. Ganesh
JNCA
2007
125views more  JNCA 2007»
13 years 8 months ago
Distributed middleware architectures for scalable media services
The fusion of Multimedia and Internet technology has introduced an ever-increasing demand for large-scale reliable media services. This exposes the scalability limitations of curr...
Vana Kalogeraki, Demetrios Zeinalipour-Yazti, Dimi...
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