The trend to multi-core chip designs presents new challenges for design automation, while the increased reuse of components may offer solutions. This paper describes some of the k...
—To maximize the communication throughput for wireless sensing systems, designers have attempted various combinations of protocol design and manual code optimization. Although th...
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
The use of textures provides a rich and diverse set of possibilities for the visualization of flow data. In this paper, we present methods designed to produce oriented and contro...
Francesca Taponecco, Timothy Urness, Victoria Inte...
—Vehicular networks are on the fast track to become a reality either through a car manufacturer that introduces a communication device in the car electronics or through an afterm...
Eugenio Giordano, Enzo De Sena, Giovanni Pau, Mari...