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DAC
2007
ACM
14 years 8 months ago
Multi-Core Design Automation Challenges
The trend to multi-core chip designs presents new challenges for design automation, while the increased reuse of components may offer solutions. This paper describes some of the k...
John A. Darringer
SUTC
2010
IEEE
13 years 10 months ago
Pushing the Throughput Limit of Low-Complexity Wireless Embedded Sensing Systems
—To maximize the communication throughput for wireless sensing systems, designers have attempted various combinations of protocol design and manual code optimization. Although th...
Vahid Salmani, Pai H. Chou
ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
12 years 9 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
GRAPHITE
2006
ACM
14 years 27 days ago
Directional enhancement in texture-based vector field visualization
The use of textures provides a rich and diverse set of possibilities for the visualization of flow data. In this paper, we present methods designed to produce oriented and contro...
Francesca Taponecco, Timothy Urness, Victoria Inte...
VTC
2010
IEEE
156views Communications» more  VTC 2010»
13 years 5 months ago
VERGILIUS: A Scenario Generator for VANET
—Vehicular networks are on the fast track to become a reality either through a car manufacturer that introduces a communication device in the car electronics or through an afterm...
Eugenio Giordano, Enzo De Sena, Giovanni Pau, Mari...