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ICCAD
1993
IEEE
121views Hardware» more  ICCAD 1993»
14 years 29 days ago
Hierarchical extraction of 3D interconnect capacitances in large regular VLSI structures
For submicron integrated circuits, 3D numerical techniques are required to accurately compute the values of the interconnect capacitances. In this paper, we describe an hierarchic...
Arjan J. van Genderen, N. P. van der Meijs
LICS
2005
IEEE
14 years 2 months ago
Model-Checking Hierarchical Structures
Hierarchical graph definitions allow a modular description of graphs using modules for the specification of repeated substructures. Beside this modularity, hierarchical graph de...
Markus Lohrey
COMPSAC
2002
IEEE
14 years 1 months ago
A Structured Approach to Handling On-Line Interface Upgrades
The Integration of complex systems out of existing systems is an active area of research and development. There are many practical situations in which the interfaces of the compon...
Cliff B. Jones, Alexander B. Romanovsky, Ian Welch
CORR
2010
Springer
63views Education» more  CORR 2010»
13 years 9 months ago
Position Analysis of the RRP-3(SS) Multi-Loop Spatial Structure
The paper presents the position analysis of a spatial structure composed of two platforms mutually connected by one RRP and three SS serial kinematic chains, where R, P, and S sta...
Carlo Innocenti, Philippe Wenger
POPL
1996
ACM
14 years 1 months ago
Using Parameterized Signatures to Express Modular Structure
Module systems are a powerful, practical tool for managing the complexity of large software systems. Previous attempts to formulate a type-theoretic foundation for modular program...
Mark P. Jones