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TCAD
2008
114views more  TCAD 2008»
13 years 8 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
JETAI
2007
131views more  JETAI 2007»
13 years 8 months ago
A computational architecture for heterogeneous reasoning
Reasoning, problem solving, indeed the general process of acquiring knowledge, is not an isolated, homogenous affair involving a one agent using a single form of representation, b...
Dave Barker-Plummer, John Etchemendy
ACMSE
2011
ACM
12 years 8 months ago
Integrating digital logic design and assembly programming using FPGAs in the classroom
Rising Field Programmable Gate Array (FPGA) market volumes combined with increasing industrial popularity have driven prices down and improved capability to the point that FPGA ha...
William M. Jones, D. Brian Larkins
HPCA
2004
IEEE
14 years 8 months ago
Wavelet Analysis for Microprocessor Design: Experiences with Wavelet-Based dI/dt Characterization
As microprocessors become increasingly complex, the techniques used to analyze and predict their behavior must become increasingly rigorous. This paper applies wavelet analysis te...
Russ Joseph, Zhigang Hu, Margaret Martonosi
PPOPP
2010
ACM
14 years 5 months ago
The LOFAR correlator: implementation and performance analysis
LOFAR is the first of a new generation of radio telescopes. Rather than using expensive dishes, it forms a distributed sensor network that combines the signals from many thousands...
John W. Romein, P. Chris Broekema, Jan David Mol, ...
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