—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Traditionally, network operators have only used simple flat-rate unlimited data plans to vie for customers. But today, with the popularity of mobile devices and exponential growt...
Soumya Sen, Carlee Joe-Wong, Sangtae Ha, Mung Chia...
Finding effective interactive deformation techniques for complex geometric objects continues to be a challenging problem in modeling and animation. We present an approach that is ...
The development of successful metaheuristic algorithms such as local search for a difficult problems such as satisfiability testing (SAT) is a challenging task. We investigate an ...
Abstract--Directional antennas offer many potential advantages for wireless networks such as increased network capacity, extended transmission range and reduced energy consumption....
Emad Felemban, Robert Murawski, Eylem Ekici, Sangj...