1472 search results - page 124 / 295 » Technique Integration for Requirements Assessment |
265
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Publication
Within-die process variations arise during integrated circuit (IC) fabrication in the sub-100nm regime. These variations are of paramount concern as they deviate the performance of...
174
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LCPC
2004
Springer
15 years 11 months ago
2004
Springer
Techniques to reduce power dissipation for embedded systems have recently come into sharp focus in the technology development. Among these techniques, dynamic voltage scaling (DVS)...
151
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ANSS
2004
IEEE
15 years 9 months ago
2004
IEEE
To enable optimizations in memory access behavior of high performance applications, cache monitoring is a crucial process. Simulation of cache hardware is needed in order to allow...
169
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LCTRTS
2001
Springer
15 years 10 months ago
2001
Springer
1 COTS (commercial off-the-shelf) devices are capable of executing powerful, distributed algorithms. Very large, adaptive systems can be created by simply integrating these devices...
192
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TCAD
2008
15 years 6 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...