Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
Ayse Kivilcim Coskun, T. T. Rosing, Keith Whisnant...
Thermal hot spots and temperature gradients on the die need to be minimized to manufacture reliable systems while meeting energy and performance constraints. In this work, we solve...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various power and performance characteristics can customize their configuration to achieve higher ...