179 search results - page 27 / 36 » Temperature-aware global placement |
DAC
1997
ACM
13 years 11 months ago
1997
ACM
This paper describes a new design methodology to analyze the on-chip power supply noise for high performance microprocessors. Based on an integrated package-level and chip-level p...
EURODAC
1994
IEEE
13 years 11 months ago
1994
IEEE
We consider a switch module routing problem for symmetric array FPGAs. The work is motivated by two applications. The rst is that of eciently evaluating switch module designs [8]...
CP
2008
Springer
13 years 9 months ago
2008
Springer
This paper presents a global constraint that enforces rules written in a language based on arithmetic and first-order logic to hold among a set of objects. In a first step, the rul...
ERSA
2004
13 years 8 months ago
2004
This paper introduces VTsim, a device simulator for Xilinx Virtex-II FPGAs. VTsim is currently a globally synchronous event-driven device simulator modeled at the CLB level. Throu...
ISCI
2007
13 years 7 months ago
2007
One of the greatest and most recent challenges for online advertising is the use of adaptive personalization at the same time that the Internet continues to grow as a global market...