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154
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ETS
2010
IEEE
174views Hardware» more  ETS 2010»
15 years 4 months ago
Test-architecture optimization for TSV-based 3D stacked ICs
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
Brandon Noia, Sandeep Kumar Goel, Krishnendu Chakr...
158
Voted
ACSC
2010
IEEE
14 years 10 months ago
Measuring visual consistency in 3d rendering systems
One of the major challenges facing a present day game development company is the removal of bugs from such complex virtual environments. This work presents an approach for measuri...
Alfredo Nantes, Ross Brown, Frédéric...
199
Voted
ISBI
2011
IEEE
14 years 7 months ago
3D segmentation of rodent brain structures using Active Volume Model with shape priors
Object boundary extraction is an important task in brain image analysis. Acquiring detailed 3D representations of the brain structures could improve the detection rate of diseases...
Shaoting Zhang, Junzhou Huang, Mustafa Gökhan...
131
Voted
SIGPRO
2008
89views more  SIGPRO 2008»
15 years 3 months ago
Radix-2 algorithm for the fast computation of type-III 3-D discrete W transform
: In this letter, an efficient algorithm for three-dimensional (3-D) vector radix decimation in frequency is derived for computing the type-III 3-D discrete W transform (DWT). Comp...
Huazhong Shu, J. S. Wu, Lotfi Senhadji, Limin Luo
121
Voted
ICIP
2006
IEEE
16 years 5 months ago
3D Scene Modeling for Distributed Video Coding
1 The compression efficiency of Distributed Video-Coding2 (DVC) suffers from the necessity of transmitting a large num-3 ber of key-frames which are intra-coded. This paper describ...
Matthieu Maitre, Christine Guillemot, Luce Morin