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SLIP
2009
ACM
14 years 3 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ICC
2008
IEEE
130views Communications» more  ICC 2008»
14 years 3 months ago
Managing Network Congestion with a Kohonen-Based RED Queue
— The behaviour of the TCP AIMD algorithm is known to cause queue length oscillations when congestion occurs at a router output link. Indeed, due to these queueing variations, en...
Emmanuel Lochin, Bruno Talavera
ICIP
2007
IEEE
14 years 3 months ago
Complexity Control for Real-Time Video Coding
A methodology for complexity scalable video encoding and complexity control within the framework of the H.264/AVC video encoder is presented. To yield good rate-distortion perform...
Emrah Akyol, Debargha Mukherjee, Yuxin Liu
LICS
2007
IEEE
14 years 3 months ago
Static Name Control for FreshML
FreshML extends ML with constructs for declaring and ting abstract syntax trees that involve names and statically scoped binders. It is impure: name generation is an observable si...
François Pottier
NCA
2007
IEEE
14 years 3 months ago
Improving Network Processing Concurrency using TCPServers
Exponentially growing bandwidth requirements and slowing gains in processor speeds have led to the popularity of multiprocessor architectures. Network stack parallelism is increas...
Aniruddha Bohra, Liviu Iftode