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ASPDAC
2012
ACM
238views Hardware» more  ASPDAC 2012»
12 years 3 months ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
HICSS
2012
IEEE
265views Biometrics» more  HICSS 2012»
12 years 3 months ago
Change and Control Paradoxes in Mobile Infrastructure Innovation: The Android and iOS Mobile Operating Systems Cases
The advent of the smartphone as a highly complex technology has been accompanied by mobile operating systems (OS), large communities of developers, diverse content providers, and ...
David Tilson, Carsten Sørensen, Kalle Lyyti...
KDD
2012
ACM
178views Data Mining» more  KDD 2012»
11 years 10 months ago
Mining event periodicity from incomplete observations
Advanced technology in GPS and sensors enables us to track physical events, such as human movements and facility usage. Periodicity analysis from the recorded data is an important...
Zhenhui Li, Jingjing Wang, Jiawei Han
MOBISYS
2009
ACM
14 years 8 months ago
Leveraging smart phones to reduce mobility footprints
Mobility footprint refers to the size, weight, and energy demand of the hardware that must be carried by a mobile user to be effective at any time and place. The ideal of a zero m...
Stephen Smaldone, Benjamin Gilbert, Nilton Bila, L...
MOBISYS
2008
ACM
14 years 7 months ago
Trustworthy and personalized computing on public kiosks
Many people desire ubiquitous access to their personal computing environments. We present a system in which a user leverages a personal mobile device to establish trust in a publi...
Scott Garriss, Ramón Cáceres, Stefan...