598 search results - page 84 / 120 » The Puzzle Layout Problem |
ASPDAC
2011
ACM
12 years 11 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ISPD
2011
ACM
12 years 10 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
ALGORITHMICA
1998
13 years 7 months ago
1998
Abstract. We study some minimum-area hull problems that generalize the notion of convex hull to starshaped and monotone hulls. Specifically, we consider the minimum-area star-shap...
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
MOBIHOC
2003
ACM
14 years 7 months ago
2003
ACM
In this paper we present GOAFR, a new geometric ad-hoc routing algorithm combining greedy and face routing. We evaluate this algorithm by both rigorous analysis and comprehensive ...