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MJ
2011
288views Multimedia» more  MJ 2011»
13 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
IPPS
2007
IEEE
14 years 2 months ago
Power, Performance, and Thermal Management for High-Performance Systems
In future high-performance systems it will be essential to balance often-conflicting objectives of performance, power, energy, and temperature under variable workload and environ...
Heather Hanson, Stephen W. Keckler, Karthick Rajam...
IPPS
1998
IEEE
14 years 2 days ago
Thermal Management in Embedded Systems Using MEMS
Jeffrey T. Draper, Jay Block, Jeff Koller, Craig S...
GLVLSI
2005
IEEE
122views VLSI» more  GLVLSI 2005»
14 years 1 months ago
Thermal aware cell-based full-chip electromigration reliability analysis
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
ICCAD
2009
IEEE
171views Hardware» more  ICCAD 2009»
13 years 5 months ago
A hybrid local-global approach for multi-core thermal management
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Ramkumar Jayaseelan, Tulika Mitra