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TCAD
2008
114views more  TCAD 2008»
13 years 8 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
ISESE
2006
IEEE
14 years 2 months ago
An empirical study of developers views on software reuse in statoil ASA
In this article, we describe the results from our survey in the ITdepartment of a large Oil and Gas company in Norway (Statoil ASA), in order to characterize developers’ views o...
Odd Petter N. Slyngstad, Anita Gupta, Reidar Conra...
ISSTA
2010
ACM
14 years 15 days ago
Automatic detection of unsafe component loadings
Dynamic loading of software components (e.g., libraries or modules) is a widely used mechanism for improved system modularity and flexibility. Correct component resolution is cri...
Taeho Kwon, Zhendong Su
COMPSAC
2006
IEEE
14 years 2 months ago
Automated Agent Synthesis for Situation Awareness in Service-Based Systems
Service-based systems have many applications, such as collaborative research and development, e-business, health care, military applications, and homeland security. In dynamic ser...
Stephen S. Yau, Haishan Gong, Dazhi Huang, Wei Gao...
FLAIRS
1998
13 years 10 months ago
The Program Analysis Tool for Reuse: Identifying Reusable Components
Software reuse has been demonstrated to increase productivity, reduce costs, and improve software quality. The research that has addressed this problem has concentrated on code cr...
Letha H. Etzkorn, Carl G. Davis, Lisa L. Bowen, Ja...