A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
We propose a novel probabilistic framework for learning
visual models of 3D object categories by combining appearance
information and geometric constraints. Objects are
represen...
We introduce a 3-D parametric active contour algorithm for the shape estimation of DNA molecules from stereo cryo-electron micrographs. We consider a 3-D filament (consisting of a...
This paper addresses the problem of tracking a 3D plane over a sequence of images acquired by a free moving camera, a task that is of central importance to a wide variety of visio...
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...