As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Abstract. In this paper, we propose a novel and fast method to localize and track needles during image-guided interventions. Our proposed method is comprised of framework of needle...