108 search results - page 18 / 22 » aspdac 2008 |
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
In modern circuit design, it is difficult to provide reliable parametric yield prediction since the real distribution of process data is hard to measure. Most existing approaches ...
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
At system level, the on-chip temperature depends both on power density and the thermal coupling with the neighboring regions. The problem of finding the right set of input power pr...
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
Nowadays many customised embedded processors offer the possibility of speeding up an application by implementing it using Application-Specific Functional units (AFUs). However, th...
ASPDAC
2008
ACM
13 years 11 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...