12 search results - page 2 / 3 » aspdac 2012 |
118
click to vote
ASPDAC
2012
ACM
13 years 10 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...
135
click to vote
ASPDAC
2012
ACM
13 years 10 months ago
2012
ACM
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
131
click to vote
ASPDAC
2012
ACM
13 years 10 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
143
click to vote
ASPDAC
2012
ACM
13 years 10 months ago
2012
ACM
Behavioral synthesis tools have made significant progress in compiling high-level programs into register-transfer level (RTL) specifications. But manually rewriting code is still ...
103
click to vote
ASPDAC
2012
ACM
13 years 10 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...