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ICCAD
2007
IEEE
14 years 7 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
SOSP
2007
ACM
14 years 6 months ago
2007
ACM
ion Flow Control for Standard OS Abstractions Maxwell Krohn Alexander Yip Micah Brodsky Natan Cliffer M. Frans Kaashoek Eddie Kohler† Robert Morris MIT CSAIL †UCLA http://flum...
ASIACRYPT
2009
Springer
14 years 4 months ago
2009
Springer
The design of cryptographic hash functions is a very complex and failure-prone process. For this reason, this paper puts forward a completely modular and fault-tolerant approach to...
3DIM
2007
IEEE
14 years 4 months ago
2007
IEEE
In this contribution we introduce the Multiocular Contracting Curve Density algorithm (MOCCD), a novel method for fitting a 3D parametric curve. The MOCCD is integrated into a tr...
ANSS
2007
IEEE
14 years 4 months ago
2007
IEEE
This work describes a Java based development platform which is intended to support ad hoc network researchers in application and protocol design. Software development within this ...