As technology scales and frequency increases, a new design style is emerging, referred to as hybrid designs, which contain a mixture of random logic and datapath standard cell com...
Samuel I. Ward, Myung-Chul Kim, Natarajan Viswanat...
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Abstract—This work introduces GRIP, a global routing technique via integer programming. GRIP optimizes wirelength and via cost directly without going through a traditional layer ...
Tai-Hsuan Wu, Azadeh Davoodi, Jeffrey T. Linderoth