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51
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TCAD
2011
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Software Engineering
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TCAD 2011
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Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs
13 years 6 months ago
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www.gtcad.gatech.edu
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
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