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    ASPDAC
    2005
    ACM
    86views Hardware» more  ASPDAC 2005»
    Thermal-driven multilevel routing for 3-D ICs
    14 years 8 months ago
    Thermal-driven multilevel routing for 3-D ICs
    Download  cadlab.cs.ucla.edu
    3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
    Jason Cong, Yan Zhang
    claim paper
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