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52
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ICPP
2007
IEEE
146
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Distributed And Parallel Com...
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ICPP 2007
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Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
14 years 5 months ago
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www.hal.ipc.i.u-tokyo.ac.jp
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...
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