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    ISVLSI
    2007
    IEEE
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    Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
    14 years 5 months ago
    Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
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    As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
    Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...
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