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ISVLSI
2007
IEEE
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14 years 6 months ago
Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...