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    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    14 years 21 days ago
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
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    Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
    Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
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