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MR
2006
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13 years 10 months ago
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...