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    ICIP
    2007
    IEEE
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    Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
    14 years 6 months ago
    Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
    Download  www.fjt.info.gifu-u.ac.jp
    High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed a...
    Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Ts...
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