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    ASPDAC
    2006
    ACM
    134views Hardware» more  ASPDAC 2006»
    Constraint driven I/O planning and placement for chip-package co-design
    14 years 5 months ago
    Constraint driven I/O planning and placement for chip-package co-design
    Download  eda.ee.ucla.edu
    System-on-chip and system-in-package result in increased number of I/O cells and complicated constraints for both chip designs and package designs. This renders the traditional ma...
    Jinjun Xiong, Yiu-Chung Wong, Egino Sarto, Lei He
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