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    ISQED
    2003
    IEEE
    86views Hardware» more  ISQED 2003»
    Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform
    14 years 4 months ago
    Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform
    Download  www.cecs.uci.edu
    This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
    Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
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