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    GLVLSI
    2006
    IEEE
    119views VLSI» more  GLVLSI 2006»
    Thermal analysis of a 3D die-stacked high-performance microprocessor
    14 years 5 months ago
    Thermal analysis of a 3D die-stacked high-performance microprocessor
    Download  www.cc.gatech.edu
    3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
    Kiran Puttaswamy, Gabriel H. Loh
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