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MR
2006
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Robotics
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MR 2006
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Electromigration lifetimes and void growth at low cumulative failure probability
13 years 8 months ago
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www.electronics.uni-wuppertal.de
We studied electromigration (EM) lifetimes and void growth at low cumulative failure probability. We carried out EM test in damascene Cu lines using sudden-death type test structu...
Hideaki Tsuchiya, Shinji Yokogawa
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