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ICCAD
2007
IEEE
140views Hardware» more  ICCAD 2007»
14 years 8 months ago
Thermal-aware Steiner routing for 3D stacked ICs
— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
Mohit Pathak, Sung Kyu Lim