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38
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ICCD
2004
IEEE
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ICCD 2004
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3D Processing Technology and Its Impact on iA32 Microprocessors
14 years 7 months ago
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iccd.et.tudelft.nl
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
Bryan Black, Donald Nelson, Clair Webb, Nick Samra
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