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ICCD
2004
IEEE
131views Hardware» more  ICCD 2004»
14 years 8 months ago
3D Processing Technology and Its Impact on iA32 Microprocessors
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
Bryan Black, Donald Nelson, Clair Webb, Nick Samra